This major was the first national undergraduate major in electronic packaging technology in 2009, and it is also the unique national characteristic major of the electronic packaging category in the country. In 2017, this major was evaluated by Research Center for Chinese Science Evaluation and China Education Quality Evaluation Center, Wuhan University, ranking first in the country, being the only five-star packaging major.
This major adheres to the training characteristics of solid foundation, wide caliber, considerable practice and refined skills, and trains patriotic and enterprising versatile talents with solid theoretical knowledge, rich professional knowledge, international vision and innovative spirit, standardized engineering quality and good occupational ethics, professional knowledge in machinery, electronics, thermal transfer, and electromagnetic design and packaging and test that can be engaged in scientific research, design and development, operation management and business sales in high-end electronic manufacturing, integrated circuit packaging and test, microsystem design and other fields.
Graduates of this major can be engaged in electronic product design, manufacturing, process, test, research and development, management and business sales and so on in enterprises and public institutions in the fields such as communication, electronics, computers, aerospace, integrated circuits, semiconductor devices, microelectronics and optoelectronics, and automatic production lines, and can study for a master's degree, master of engineering and doctoral degree. Over the three years, graduates of this major have successively worked at domestic and foreign well-known enterprises and public institutions such as South Korea's Samsung, Huawei, ZTE, Midea, Skyworth, TCL, Tencent, the 771st Research Institute, CASC (China Aerospace Science and Technology Corporation), the 58th Research Institute of CETC (China Electronics Technology Group Corporation), the 49th Research Institute of CETC, the 20th Research Institute of CETC, National Research Center for Information Technology Security, and Taiwan ASE Group, with an employment rate of over 97%. Most graduates are engaged in technology and management work in transnational corporations and national key enterprises and public institutions in cities of Beijing, Shanghai, Guangzhou, Shenzhen, Chongqing, and Tianjin, and provincial capitals. In the past three years, the number of graduates who have been recommended and admitted for master degrees accounted for 40% of the graduates, including many well-known foreign universities, such as American Columbia University, University of Illinois at Chicago, German Technische Universität München (Technical University of Munich), and Gerhard Mercator Universität Duisburg (Gerhard Mercator University).
Main courses include Introduction to Computer and Programming, Mechanical Drawing, Fundamentals of Graphics and Computer Graphics (Bilingual), Theoretical Mechanics, Mechanics of Materials, Theory of Machines and Mechanisms, Engineering Fluid Mechanics (Bilingual), Engineering Heat Transfer, Electronic Packaging and Fundamentals of Mechanical Design, Basis of Electrical Circuit Analysis, Digital Circuit and Logic Design, Analog Electronic Technology, Signals and Systems, Microcomputer Principle and System Design, Fundamentals of RF Circuits, Introduction to Microelectronics, Electromagnetic Compatibility Design and Signal Integrity, Principles of Automatic Control, Structure Design of Electronic Packing, Material and Technology of Electronic Packing, Packaging Technology of Micro Electromechanical System, Comprehensive Practice of Electronic Manufacturing Technology, Intelligent Manufacturing Electromagnetic Analysis and Application, Electronic Product Thermal Design and Experiments and Comprehensive Experiments, etc.
