⟡ Team leader Wenchao Tian

⟡ Team members

⟡ Group introduction

There are 7 members in the team, including Professor Wenchao Tian, associate professor Yanrong Cao and Yongkun Wang, lecturers Jing Shi, Zhongliang Xie, Fei Xin and Zhiqiang Chen. They all have doctoral degrees granted by universities in "Project 211" or "Project 985", with an average age of 34. 6 of them have overseas study experience in famous foreign universities. Over the years, over 70 projects of major projects of the National Natural Science Foundation of China (NSFC), general programs of NSFC, Fund for Excellent Youth of NSFC, Emergency Management Projects of NSFC, national 973 Program, national science and technology support projects, pre-research projects of the General Armaments Department, postdoctoral fund, Natural Science Foundation of Shaanxi, Natural Science Foundation of Ningbo, Fund of China Space Foundation, Huawei Fund, Xi'an AM Fund have been undertaken. It 4 monographs and over 130 academic papers have been published, over 100 of which have been included in SCI. And there are 21 authorized invention patents and 2 patent transfer.

⟡ Talents, important achievements and awards

1.    General program of NSFC: research on key technologies of micro-actuators with low voltage, high speed and large deformation based on buckling

2.    Sub-project of major projects of NSFC: research on the degradation mechanism of ultra-thin gate dielectric under multiple stress conditions

3.    Emergency management project of NSFC: modeling and analysis of a new RF MEMS switch with high power, high frequency, and multichannel.

4.    Innovation fund of the Ministry of Science and Technology: digital high-temperature sensorless DC brushless motor servo driver

The Bronze Prize of Shaanxi Scientific and Technical Worker Innovation and Entrepreneurship Competition was awarded in 2017

The E Group of the 3rd "Fenglu Talents" Plan was awarded in 2015

⟡ Main research areas

1.    Micro electromechanical technology

Intelligent microsensors and drivers, RF switches, microwave devices, micropumps, micro fluid systems, micro heat dissipation，refactoring antenna，phase shifter and etc.

Fig. Refactoring antenna

2.    Advanced packaging technology

Package of the device level and circuit board level, thermal design in micro package, electromagnetic coupling, high-speed signal, vibration and shock, failure mechanism and life prediction, reliability analysis; 3D lamination, TSV technology, SIP technology, microsystems, and other advanced packaging technology analysis.

Fig.2 Bonding and signal analysis       Fig.3 Reliability analysis of circuit board level

3.    New material devices and reliability

Analysis, preparation and testing of smart materials of GaN and other semiconductor materials, piezoelectric materials, and shape-memory polymers; the structural reliability research of electronic devices.

Fig.4 New material testing and analysis

⟡ Doctor/Master Admissions (please refer to the Admissions Information for details)